GETECH Automation Pte Ltd

	Marking System - GMS Whether for traceability of components or for user identification, Getech Marking System can easily be included into the production line or specific marking island. Ink marking, instantly dry to the touch, and a permanent after the reflow oven, provides a high definition print, where laser marking or label placement are not an option. GMS is an inline compact automatic board marking system that utilizes the latest robotic manipulators, interfaced with advanced inkjet printing technology to enable accurate high-speed printing, direct on the substrate such as PCB capable of printing human readable characters, bar code and 2D matrix. Options include “Print verification camera” C axis for multi directional printing and pre & post print Flip stations.
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	Auto Label Placer - ALP The ALP is a high speed inline label placer, offer in high position placement of pre printed labels. (Up to 16 labels on a memory board in 25 seconds.) Options include “Print then place”, dual PnP and/or dual label dispensers and configurations.
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	Odd-Form Placement - OFP The OFP provides the efficient solution for that “awkward part”. Designed for high or medium volume, these systems can be adjusted to customers' changing product and process using different types of PnP modules. The OFP platform can be easily configured to suit the specific needs of the customer, be it insertion of connectors, placement of IC or insertion of optical devices. We offer a full range of feeders from tape, waffle/gel pack, vibratory bowl and tray, to provide the highest flexibility and best price/ performance ratio in odd-form component placement.
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	Board Gauging System - BGS The BGS is a fully automatic inline two dimensional high resolution scanning machine for inspection and gauging of PCB assemblies.
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	Finished Board Handler - FBH The FBH is the ideal flexible solution for off loading PCB from a conveyor and places them into trays. Designed to accept a range of stackable specialized or standard trays, which are manually stacked up one side of machine and the “stack” of full trays are removed when full. Options include a flip station and reject station. When linked to the RBM / IDM and ALP, this line provides for full EoL capability.
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	Flip Chip Assembly - FCA The new Getech Flip Chip Assembly machine is designed for high-speed placement of fine pitch (0.1mm) CSP and µBGA. The FCA applies the latest technology to the four key elements for high speed component placement: precision placement, vision technique, component feeding and high speed fluxing.
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	Offline Marking System - OMS This is an offline table top machine which uses an ink jet printer to automatically print on boards.
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