The VSLT is designed to
1. Replacement of existing manual test stations with fully automatic test system for new generation
CPU/Graphic Processor.
2. Improve cycle time, productivity and reduce components failure rate in manual handling.
3. Automatic pick and place of BGA/PGA to customer's test and board/tester for socket level testing.
4. Can sort devices according to test result (binning assignment).
5. Optional ball or pin missing check available.
6. Device test temperature ambient to 90 °.
7. Contact pressure is: Min 30kgf to Max 70kgf.
8. Package size: BGA, PGA and other SMT devices.
9. Throughput is 330UPH (Zero Test Time, 6X4 configuration).
10.Binning trays (7): 2 Auto Loader/unloader, 2 auto loader & 3 single trays.
11.Standard system is 22 cells (6X4), can be configured to request, 18 to 30 cells.